WAFER LEVEL INTEGRATION OF MULTIPLE OPTICAL ELEMENTS

摘要

Integrated multiple optical elements may be formed by bonding substrates (10, 12) containing such optical elements together or by providing optical elements (22, 28) on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. A seal (16) for each die preventing the dicing slurry from getting between the wafers is desirable. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.