| 摘要 |
<p>A polishing apparatus (P) can produce a uniform quality of polished products by supplying a polishing solution consistently without being affected by any disturbances in the solution supply source. The polishing apparatus (P) comprises: a polishing section for polishing a workpiece by pressing the same against a polishing tool (30); a solution piping assembly (46) to be connected to an external solution supply device (36) for transferring a polishing solution therefrom to the polishing section; and a solution suction device (48) provided in the solution piping assembly (54) for introducing the polishing solution from the solution supply device (36) to the polishing section (P) at a desired flow rate.</p> |
