发明名称 Light emitting semiconductor device e.g. an LED component
摘要 A light emitting semiconductor device (21) has a light emitting element (6) which is completely sealed with an opaque sealing resin (8) except for a light emitting region at the opposite side from its mounting substrate (1) or circuit board. Preferred Features: The light emitting element (6) comprises a sapphire substrate (6b) supporting a light emitting layer of GaN based compound semiconductor. The sealing resin (8) is reinforced with a filler such as aluminum oxide, carbon or silicon oxide.
申请公布号 DE19901918(A1) 申请公布日期 1999.07.29
申请号 DE1999101918 申请日期 1999.01.19
申请人 ROHM CO. LTD., KYOTO, JP 发明人 TODA, HIDEKAZU, KYOTO, JP;ISOKAWA, SHINJI, KYOTO, JP
分类号 H01L33/40;H01L33/46;H01L33/48;H01L33/54;H01L33/56;H01L33/62;(IPC1-7):H01L33/00 主分类号 H01L33/40
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