发明名称 |
Light emitting semiconductor device e.g. an LED component |
摘要 |
A light emitting semiconductor device (21) has a light emitting element (6) which is completely sealed with an opaque sealing resin (8) except for a light emitting region at the opposite side from its mounting substrate (1) or circuit board. Preferred Features: The light emitting element (6) comprises a sapphire substrate (6b) supporting a light emitting layer of GaN based compound semiconductor. The sealing resin (8) is reinforced with a filler such as aluminum oxide, carbon or silicon oxide.
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申请公布号 |
DE19901918(A1) |
申请公布日期 |
1999.07.29 |
申请号 |
DE1999101918 |
申请日期 |
1999.01.19 |
申请人 |
ROHM CO. LTD., KYOTO, JP |
发明人 |
TODA, HIDEKAZU, KYOTO, JP;ISOKAWA, SHINJI, KYOTO, JP |
分类号 |
H01L33/40;H01L33/46;H01L33/48;H01L33/54;H01L33/56;H01L33/62;(IPC1-7):H01L33/00 |
主分类号 |
H01L33/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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