PROCESS FOR PRODUCING A PLASTIC OBJECT CONTAINING AN ELECTRONIC COMPONENT

摘要

In a process for producing a plastic object (40) containing an electronic component, the electronic component mounted on a structure (12) is secured to a foil in that its structure (12) is fixed to the foil (10) by deformation of the foil (10). The foil (10) is then embedded together with the electronic component in a plastic mass (42). The foil (10) is deformed by means of a die (24) movable from its starting position, in which its front (28) is spaced apart from the foil (10) and the structure (12), into an end position. At least the foil (10) is deformed in such a way (12) that the structure (12) is fixed to the foil (10) by form-fit or positive engagement. In addition, while the foil is deformed, a possibly available printed circuit (11) can be bent out of its original plane in order to bring a contact section (11.1) of the printed circuit (11) into contact with a conducting edge area (12.1) of the structure (12). The electronic component is fixed to the foil (10) and electrically connected to the printed circuit (11).