发明名称 Method of soldering an arrangement contg. a honeycomb body in a casing tube
摘要 The method involves making the honeycomb body (6) by stacking and/or wrapping plate layers, of which at least some are structured, so that honeycomb body has fluid flow channels, partially fitting the honeycomb body into the casing tube (1), bringing the protruding body into contact with an adhesive, fitting the body into the tube and introducing solder at least into the honeycomb body. A further part of the body is brought into contact with an adhesive before applying the solder
申请公布号 DE19803012(A1) 申请公布日期 1999.07.29
申请号 DE1998103012 申请日期 1998.01.27
申请人 EMITEC GESELLSCHAFT FUER EMISSIONSTECHNOLOGIE MBH, 53797 LOHMAR, DE 发明人 WIERES, LUDWIG, 51491 OVERATH, DE
分类号 B01D53/88;B01D53/94;B23K1/00;B23K3/06;F01N3/28;(IPC1-7):B23K1/00;B23K1/20 主分类号 B01D53/88
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