发明名称 MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME, AND INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <p>An accumulation region (15) comprises many dispersed dots (15a) whose surface density is higher than that of structural pin-holes produced in a tunnel insulating film (14a). Alternatively, the number of dots (15a) in the accumulation region (15) is determined to be five or more. Alternatively, a conduction region (13c) is formed in a polysilicon layer (13) whose surface roughness is greater than 0.1 nm and less than 100 nm. The number of dots (15a) in the accumulation region (15) is larger than the number of grains in the conduction region (13c). Even if defects, such as pin-holes, occur in the tunnel insulating film (14a) and charges accumulated in some dots leak, the charges accumulated in the dots in the regions where no defect is present do not leak. Therefore, information can be held for a long time.</p>
申请公布号 WO1999038213(P1) 申请公布日期 1999.07.29
申请号 JP1999000313 申请日期 1999.01.26
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