| 摘要 |
PROBLEM TO BE SOLVED: To realize solder crack resistance and heat cycle crack resistance by making a lead frame of a copper-based metal, and using, as essential element of a sealing material, polyglycidyl ether of polyphenols bonded with phenols with an alicyclic hydrocarbon group as a coupling group, a hardening agent and an inorganic filler. SOLUTION: An electrode portion within a semiconductor element and a lead frame made of a copper-based metal are joined with each other and sealed by a sealing material in such a manner as to fix to semiconductor element and the lead frame. This sealing material contains, as essential elements, polyglycidyl ether of polyphenols having structure bonded with phenols with an alicyclic hydrocarbon group as a coupling group, a hardening agent and an inorganic filler. Thus, excellent solder crack resistance and heat cycle crack resistance, and significantly high heat dissipation property may be realized. |
