| 发明名称 |
Method and apparatus for drilling microvia holes in electrical circuit interconnection packages |
| 摘要 |
<p>This invention relates to using mid-infrared high-power pulsed laser radiation sources for drilling high-quality microvia interconnection holes in printed circuit (wiring) boards and other electrical circuit packages.</p> |
| 申请公布号 |
GB9912274(D0) |
申请公布日期 |
1999.07.28 |
| 申请号 |
GB19990012274 |
申请日期 |
1999.05.27 |
| 申请人 |
EXITECH LIMITED |
发明人 |
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| 分类号 |
B23K26/00;B23K26/06;B23K26/38;B23K101/42;H05K3/00 |
主分类号 |
B23K26/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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