| 摘要 |
<p>PURPOSE:To provide the title photocoupling device capable of diminishing the development of defects by a method wherein said device is frameless structured to be wired of metallic plating, etc., on a thermal resistant substrate. CONSTITUTION:The first recession part 12 is formed on the first insulating substrate 11a and then the second recession part 13 is formed on the bottom surface of the first recession part 12 while thin film type wiring electrode parts 16a, 17a are three demensionally formed in the second part 13 furthermore a light emitting element 14 is mounted on the electrode part 17a in the second recession part 13. Next, the second insulating substrate 11b in size capable of fitting the first recession part 12 is provided and then the other thin film wiring electrode 18 is formed on the second insulating substrate 11b, next, a photodetector 15 is mounted on said wiring electrode 18 while the second insulating substrate 11b is fitted to the first recession part 12 of the first insulating substrate 11a so that the light emitting element 14 and the photodetector 15 may be oppositely arranged. Later, a transparent resin 28 a photoshielding resin 29 are successively filled up in said recession parts 18 and 12 to be lead frameless structured thereby enabling the reliability of the title photocoupling device to be enhanced.</p> |
