发明名称 |
Heat-conductive composite material |
摘要 |
A heat-conductive composite material usable as a substrate (heat sink) for mounting a semiconductor thereon or a lead frame is provided, which comprises a core sheet (14) and metal foil layers (16) welded to the both surfaces of the core sheet. The core sheet (14) is composed of a metal sheet (11) of high thermal expansion sandwiched between two metal sheets (12) of low thermal expansion each having a number of through-holes (13) in the direction of the thickness, and the three layers (12,11,12) are laminated and integrated so that a part of the metal sheet (11) of high thermal expansion is exposed out to the metal surfaces of low thermal expansion through the through-holes (13) of the metal sheets (12) of low thermal expansion. |
申请公布号 |
EP0634794(B1) |
申请公布日期 |
1999.07.28 |
申请号 |
EP19940202767 |
申请日期 |
1990.05.25 |
申请人 |
SUMITOMO SPECIAL METALS CO., LTD. |
发明人 |
NAKAMURA, YASUYUKI;HIRANO, KENJI |
分类号 |
H01L23/373;H01L23/495 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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