| 摘要 |
A method of manufacturing a field emission element including the steps of: forming an opening in a partial region of a first film formed on an underlying substrate and thereafter forming a first sacrificial film; etching back the first sacrificial film to expose the surface of the first film and leave a side spacer on the side wall of the opening, the side spacer being made of the first sacrificial film, and continuing to etch back the first sacrificial film to form a recess in the underlying substrate; depositing a second sacrificial film on the recess, the side spacer and the first film to a thickness larger than the radius of curvature of a rounded corner at the bottom of the recess, to form a cusp on the surface of the second sacrificial film, the cusp having a sharp apex at a deepest point where side walls of the second sacrificial film as viewed in cross section contact at the first time; and forming a field emission cathode electrode having a sharp apex by depositing a conductive film on the second sacrificial film.
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