发明名称 THERMOCOMPRESSION BONDING AND BATTERY OR CELL
摘要 PROBLEM TO BE SOLVED: To diffuse and join a metal to ceramics by bringing the metal into pressure contact with the ceramics at normal temperatures under a high pressure, heating both at a high temperature for a prescribed time while retaining the pressing force and opening the pressure when returning the temperature again to the normal one. SOLUTION: This method is to thermocompression bond ceramics to a metal without requiring a driving part or a pressurizing mechanism having heat resistance. A means for holding the pressure using a jig such as one or more coned disk springs is cited as the means. An SUH material or an NCF material which is a heat-resistant metal is used as the coned disk spring material. As an example for assembling a cell or a battery B according to this method, a cathode cylinder 1 made of stainless steel, a thin plate ring made of aluminum (not shown in the figure, but placed between the cathode cylinder 1 and a ceramic ring 3), the ceramic ring 3, the thin plate ring (not shown) and an anode cylinder 5 made of the stainless steel are piled up from the upper part in the center of the jig J and flange parts of the cathode cylinder 1 and the anode cylinder 5 are pressed with flange pressers J1 and J2. The resultant assembly is then pressurized and set through the coned disk springs J3 and J4. The assembly, together with the jig J, is heated and joined.
申请公布号 JPH11199341(A) 申请公布日期 1999.07.27
申请号 JP19980003640 申请日期 1998.01.12
申请人 HITACHI LTD 发明人 AMIMOTO TOSHIYUKI
分类号 B23K20/00;C04B37/02;H01M10/39;(IPC1-7):C04B37/02 主分类号 B23K20/00
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