发明名称 Means for controlling thermal properties of AMTEC cells
摘要 The present invention provides an AMTEC cell having a more robust power conductance path (conduction, radiation, convection, and latent heat transfer) from the heat input surface of the cell to the working fluid, evaporation surface, and SES. More particularly, one embodiment of the present invention includes collars, post and/or bridges extending between the SES support plate and the heat input surface. In another embodiment, a plurality of channels or conduits extend between the heat input surface and SES support plate. These embodiments simultaneously increase the thermal conductance path between the heat input surface of the cell and the evaporation surface as well as between the heat input surface of the cell and the SES, and enables superheating of the working fluid. Additionally, posts, fins or heat pipes may be provided in the low pressure zone of the cell between members of the SES to simultaneously increase the conductance between the heat input surface of the cell and the evaporation surface, raise the temperature of the SES, through radiation and/or conduction heat transfer, and isothermalize the SES. Furthermore, posts, fins, or heat pipes may extend from the heat input surface of the cell to a location proximate the SES on the high pressure side to simultaneously raise the temperature of the SES through radiation and conduction heat transfer, isothermalize the SES, and superheat the working fluid through convective heat transfer.
申请公布号 US5928436(A) 申请公布日期 1999.07.27
申请号 US19970806606 申请日期 1997.02.26
申请人 ADVANCED MODULAR POWER SYSTEMS, INC. 发明人 BORKOWSKI, CHRIS A.;HENDRICKS, TERRY J.;SIEVERS, ROBERT K.
分类号 H01J45/00;(IPC1-7):H01L35/30 主分类号 H01J45/00
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