| 摘要 |
PROBLEM TO BE SOLVED: To prevent wafers from stocking to each other when a work (a material to be cut) is cut. SOLUTION: With regard to a wire type cutting device (a wire saw), a gap retaining body 10 softer than the material of a work 3 is arranged movably in the work 3 feeding direction. The work 3 is cut as it is fed and, when a wafer 3a is formed, the end of the wafer 3a is intruded into the surface of the gap retaining body 10. A gap 4 between the wafers 3a is maintained because a part 10a of the surface of the gap retaining body 10 is intruded into the gap 4 between the wafers 3a. Adjoining wafers 3a are prevented from stocking to each other. |
