Covered wire connection structure

摘要

Two covered wires to be conductively connected with each other are overlapped with each other at connection portions. The overlapped connection portions are pinched by a pair of resin chips and then cover portions are melted and conductive wire portions of the covered wires are conductively contacted with each other by pressing from the outside of the resin chips at the connection portions. The pair of the resin chips are melted together to seal the connection portions. The pair of the resin chips are provided with wire introducing hole portions formed in a shape of non-through hole gradually narrowing from the introducing end toward the connection portion when the resin chips are fit together. With the cover portions at least at the introducing ends of the covered wires in the wire introducing hole portions left, the resin chips are melted together. Thus, it is possible to ensure an excellent melting operation efficiency and improve the mechanical strength of the entire connection portions.