| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition which has improved flowability and moldability and can give a cured product reduced in warpage and improved in thermal cycling resistance, and resistance to soldering reflow by mixing an epoxy resin with a curing agent, a cure accelerator, a specified silicone compound, an alkoxysilane compound, and an inorganic filler. SOLUTION: This composition is obtained by mixing (a) an epoxy resin with (b) a curing agent, (c), a cure accelerator, (d) a silicone compound of formula I (X is a 1-5C alkoxyl; Y is epoxy or hydroxyl; Z is a polyether, and l, m, n, and o are each a positive integer), (e) alkoxysilane-containing compounds represented by formula II (R1 is methyl or ethyl; and R2 is epoxy) and/or formula III (R1 is methyl or ethyl; and R2 is amino or mercapto), and (f) an inorganic filler having a particle diameter of 0.1-100μm and a mean particle diameter of 2-20μm in such amounts that the relationships: 0.5<=A+B<=20, and 0.1<=A/B<=20 (A and B are the amounts of components d and e used per 100 pts.wt. component a) hold and that the amount of component f is 85.0 vol.% or above. |
