| 摘要 |
PROBLEM TO BE SOLVED: To provide a molded body for polishing and a surface plate for polishing, in which the molded body is used, in addition to the method of polishing, which can alleviate the burden of the problem of waste liquid, which allows efficient polishing to a material to be polished in spite of the same degree of finishing in polishing as that attained by the conventional method, and which can increase the efficiency of polishing work owing partly to high durability of the molded body for polishing, in the process of polishing a semiconductor substrate such as a silicone wafer, the material for substrates such as an oxide substrate, and the material for optical instruments requiring precise processing by employing such an abrasive liquid as containing no free, abrasive grains or as containing a little quantity of free, abrasive grains. SOLUTION: A molded body for polishing consists mainly of alumina. Its bulk density is not less than 0.4 g/cm<3> and not more than 2.8 g/cm<3> , its BET ratio surface area is not less than 5 m<2> /g and not more than 250 m<2> /g, and its mean grain size is not less than 0.001 μm and not more than 0.5 μm. This molded body for polishing is used both in the surface plate for polishing and in the method of polishing. |
