| 摘要 |
PROBLEM TO BE SOLVED: To conduct polishing, with the distribution of pressing force to an object to be polished kept in an optimum condition, by controlling the pressing force of a top ring for holding the object to be polished. SOLUTION: A polishing device is provided with a turntable 2 with a polishing surface 1 and a top ring 3 for holding an object W to be polished, both of which are rotated, sliding between the polishing surface 1 and the surface to be polished of the object W to be polished, for polishing (the latter surface). In the polishing device, a load applying part to the top ring 3 is provided with a magnetic load applying device 11 incorporating a piezoelectric- crystal element for detecting the pressing force imposed on the object W to be polished, while the magnetic load applying device 11 consists of a magnetic disc 16 fixed to the top ring 3 and electromagnets 14a, 14b, which drive the magnetic disc 16 by means of the magnetic force in a non-contact manner. By controlling the magnetic force of the electromagnets 14a, 14b, based on the signal from the piezoelectric-crystal element, the pressing force of the top ring 3 to the object W to be polished can be controlled. |
