| 摘要 |
PROBLEM TO BE SOLVED: To polish a polished body in high precision in accordance with an acquired film thickness measuring result by picking up an image of a polished surface of the polished body by using a film thickness measuring means, deciding a favourable position for film thickness measurement in a short period of time in accordance with two-dimensional image information and measuring film thickness. SOLUTION: A polished body holding means 2 keeps rotating immediately above a film thickness measuring means 7. At this time, a white light source to emit flash light emits flash white light to a polished surface of a polished body in specified timing. A film thickness measuring means 7 picks up an image of the polished surface by using the flash light. A positional detection processing part 8 and a film thickness measurement computing part 9 detect a position favourable for film thickness measurement in accordance with an image picked-up observing surface, and film thickness is simultaneously measured. In the case when it is required to polish again, several conditions to acquire a desired film thickness value by polishing it again in accordance with a measured film thickness value, that is, polishing time, pressure at the time when the polished body makes contact with a polishing pad, etc., are properly changed. |
