发明名称 |
Semiconductor device and heat sink used therein |
摘要 |
The present invention relates to a semiconductor device in which inner leads of a lead frame are electrically connected to a semiconductor chip, a method for producing thereof and a lead frame used therein. The object of the present invention is to improve a strength of the lead frame and a heat release efficiency in a small-size multi-pin type semiconductor device. In the inner lead of the lead frame, a thin plate portion is formed. The thin plate portions are secured on a heat spreader. A semiconductor chip is mounted on the heat spreader. The semiconductor chip is bonded to the thin plate portions of the inner leads through wires.
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申请公布号 |
US5929513(A) |
申请公布日期 |
1999.07.27 |
申请号 |
US19970886013 |
申请日期 |
1997.06.30 |
申请人 |
FUJITSU LIMITED |
发明人 |
ASANO, YUICHI;KUBOTA, AKIHIRO;SIBASAKI, KOICHI;YONETAKE, KAZUHIRO;AOKI, TSUYOSHI |
分类号 |
H01L23/433;H01L23/495;(IPC1-7):H01L23/28;H01L23/10 |
主分类号 |
H01L23/433 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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