发明名称 Work supplying method and apparatus to batch process apparatus for semiconductor wafer with preferential treatment to time critical lots
摘要 The invention provides a work supply method and apparatus for a batch process apparatus for semiconductor wafers by which works having a comparatively severe delivery date are processed preferentially. A processing end time calculation section of a batch formation control section refers to a history file in response to a processing start report from a batch process apparatus to predict a processing end time. A work extraction section refers to a step management file to extract those of the works which can arrive at a batch process apparatus on or prior to the thus predicted processing end time. A batch formation section forms, designating the extracted works as an object of batch formation, the works into a batch such that one of the works which has the highest preferential degree is designated as a top work of the batch. A transport section transports the works of the batch collectively to the batch process apparatus.
申请公布号 US5930137(A) 申请公布日期 1999.07.27
申请号 US19960752305 申请日期 1996.11.19
申请人 NEC CORPORATION 发明人 TOGASHI, YOICHI
分类号 H01L21/02;G05B15/02;G05B19/418;(IPC1-7):G06F19/00 主分类号 H01L21/02
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