发明名称 MODIFIED POLYIMIDE RESIN AND THERMOSET RESIN COMPOSITION CONTAINING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To obtain the subject resin capable of satisfying flexibility, shrinkage at the hardening time, adhesion or the like by carrying out the reaction of a dihydric hydroxyl-terminal polybutadiene, a tetrabasic acid dianhydride and a diisocyanate compound. SOLUTION: This resin is obtained by reacting (A) a dihydric hydroxyl- terminated polybutadiene with 800-5000 number average molecular weight with (B) a tetrabasic acid dianhydride of formula I (R1 is a residue obtained by removing carboxyl groups from an organic compound containing four carboxyl groups) and (C) a diisocyanate compound, and is a modified polyimide resin of formula II [R2 is a residue obtained by removing isocyanate groups from an organic compound containing two isocyanate groups; R3 is a residue obtained by removing hydroxyl from a hydroxyl-terminated polybutadiene; L1 and M1 are composition ratios of polybutadiene units and polyimide units respectively, n1 is a degree of polymerization, and L1, M1 and n1 satisfy the formulas L1+M1=1, 0<L1<1, 0<M1<1, and 1<=n1<=10,000]. The resin is useful for an overcoating agent of a wiring circuit.</p>
申请公布号 JPH11199669(A) 申请公布日期 1999.07.27
申请号 JP19980006044 申请日期 1998.01.14
申请人 AJINOMOTO CO INC 发明人 ORIKABE HIROSHI;YOKOTA TADAHIKO
分类号 C08L79/00;C08G18/10;C08G18/34;C08G18/69;C08G18/80;C08G73/10;C08G73/14;C09D175/14;C09D179/00;H01L23/498;H05K1/00;H05K1/02;H05K1/03;H05K3/28;(IPC1-7):C08G73/14 主分类号 C08L79/00
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