| 摘要 |
The present invention discloses a structure for forming CMOS transistors with a self-aligned planarization twin-well by using fewer mask counts. An N-well is formed in the semiconductor substrate. Then, a P-well is formed against the N-well, and portion of the P-well is formed along the bottom of the N-well. An oxide region is formed on the surface of both the N- and P-wells, and covers portions of the N- and P-wells. A high energy and low dose boron blanket implantation is performed to increase the threshold voltage of the oxide region, which has been used for an ESD (Electro-Static Discharge) protection circuit. Punch-through stopping layers for the CMOS transistor are formed in the upper portion of the N-well. A BF2 ion implantation layer is formed at the top of both the N- and P-wells to increase the threshold voltages of the PMOSFET and NMOSFET transistors. A pad oxide layer is also formed to cover the top of the N- and P-wells, and portions of the pad oxide layer are then formed to be the gate oxide layer of the PMOSFET and NMOSFET transistors.
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