| 发明名称 |
Diode-laser module with a bonded component and method for bonding same |
| 摘要 |
A method for bonding a component (14) to a substrate (18) via a thermally hardened or softened bonding medium, employs PTC or NTC thermistor (24) for heating the bonding medium during bonding of the component. In one disclosed example, the method is used for bonding an optical fiber to a substrate, via a solder layer (40), in alignment with a semiconductor laser (12) in a diode-laser module (10).
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| 申请公布号 |
US5930600(A) |
申请公布日期 |
1999.07.27 |
| 申请号 |
US19970825006 |
申请日期 |
1997.03.26 |
| 申请人 |
COHERENT, INC. |
发明人 |
SEELERT, WOLF;LAWRENZ-STOLZ, JORG;WILHELM, HERRY;STAMER, KAI-PETER |
| 分类号 |
G02B6/42;H01S5/00;H05K3/34;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
G02B6/42 |
| 代理机构 |
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| 主权项 |
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