摘要 |
PROBLEM TO BE SOLVED: To provide a Cu-Mg-Zn alloy for electrical and electronic parts, excel lent in stamping characteristic (minimal in burr and sagging as well as in wear of a stamping die). SOLUTION: This alloy has a composition consisting of, by weight, 0.01-2.0% Mg, 0.01-10.0% Zn, 0.00001-0.005%, in total, of one or >=2 elements selected from the group consisting of 0.00001-0.000% Se, 0.00001-0.003% Te, 0.00001-0.003% Sb, and 0.00001-0.003% Bi, 0.00001-0.003% S, and the balance Cu with inevitable impurities. |