发明名称 Alignment-mark measurements on the backside of a wafer for synchronous wafer alignment
摘要 The present invention discloses a method for aligning a reticle with a semiconductor wafer. The method includes the steps of (a) applying a light source and an optical system for directing an incident light beam to a plurality of reticle alignment marks on the reticle to project a reticle-mark beam to an alignment detector therefrom; (b) applying the light source and the optical system for directing the incident light beam to a plurality of wafer alignment marks on a second surface of the wafer for projecting a wafer-mark beam therefrom wherein the second surface opposite a first surface of the wafer facing the reticle; and (c)applying the optical system for directing the wafer-mark beam to the alignment detector for precisely aligning the reticle and the wafer.
申请公布号 US5929997(A) 申请公布日期 1999.07.27
申请号 US19970887245 申请日期 1997.07.02
申请人 WINBOND ELECTRONICS CORP. 发明人 LIN, S. BENJAMIN
分类号 G03F9/00;(IPC1-7):G01B11/00 主分类号 G03F9/00
代理机构 代理人
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