发明名称 |
Alignment-mark measurements on the backside of a wafer for synchronous wafer alignment |
摘要 |
The present invention discloses a method for aligning a reticle with a semiconductor wafer. The method includes the steps of (a) applying a light source and an optical system for directing an incident light beam to a plurality of reticle alignment marks on the reticle to project a reticle-mark beam to an alignment detector therefrom; (b) applying the light source and the optical system for directing the incident light beam to a plurality of wafer alignment marks on a second surface of the wafer for projecting a wafer-mark beam therefrom wherein the second surface opposite a first surface of the wafer facing the reticle; and (c)applying the optical system for directing the wafer-mark beam to the alignment detector for precisely aligning the reticle and the wafer.
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申请公布号 |
US5929997(A) |
申请公布日期 |
1999.07.27 |
申请号 |
US19970887245 |
申请日期 |
1997.07.02 |
申请人 |
WINBOND ELECTRONICS CORP. |
发明人 |
LIN, S. BENJAMIN |
分类号 |
G03F9/00;(IPC1-7):G01B11/00 |
主分类号 |
G03F9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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