发明名称 Addition curable composition having self adhesion to substrates
摘要 This invention relates to the preparation of an addition curable composition having self adhesion to substrates. The addition curable composition comprises an organic polymer having on average at least 1.4 alkenyl groups per molecule, a crosslinker having on average at least 1.4 hydrosilyl groups per molecule, a platinum group metal containing catalyst, an alkoxy silicon compound and a titanium compound having Ti-O-C bonds. Another embodiment of this invention is a method of adhering the addition curable composition to a substrate surface.
申请公布号 US5928794(A) 申请公布日期 1999.07.27
申请号 US19970984397 申请日期 1997.12.03
申请人 DOW CORNING GMBH;DOW CORNING CORPORATION 发明人 KALINOWSKI, ROBERT EDWARD;TOMALIA, MARY KAY;WOLF, ANDREAS THOMAS FRANZ;YEH, MING HSIUNG
分类号 C08L83/05;C08G77/12;C08K5/5419;C08L23/22;C08L83/04;C08L101/02;C09D183/04;(IPC1-7):C08G77/08 主分类号 C08L83/05
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