发明名称 Multi-layer printed substrate
摘要 An area on which a coil part is formed on part of a substrate is secured, coil patterns are provided on a plurality of unit substrates corresponding to the area, the coil patterns of the laminated unit substrates are connected by a through hole to form the coil part, thereby resulting in miniaturization, reduction of the number of assembling processes, reduction of cost, noise prevention, and improvement of reliability. Heat radiation patterns are provided in unitary form on the coil patterns to secure a sufficient heat radiation property.
申请公布号 US5929733(A) 申请公布日期 1999.07.27
申请号 US19950555794 申请日期 1995.11.09
申请人 NAGANO JAPAN RADIO CO., LTD. 发明人 ANZAWA, SEIICHI;ITOH, HISASHI
分类号 H01F17/00;H01F27/22;H05K1/02;H05K1/16;(IPC1-7):H01F27/08;H01F27/30 主分类号 H01F17/00
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