发明名称 |
Apparatus for polishing peripheral portion of wafer |
摘要 |
A polishing apparatus of a peripheral chamfered portion of a semiconductor wafer is disclosed. The polishing apparatus comprises: a rotary drum around the periphery of which a tape having an abrasive layer thereon is wound; a first motor for rotating the rotary drum; a wafer holding mechanism which comprises a wafer holding member for holding a wafer, a second motor for rotating the wafer holding member, a supporting member for supporting the wafer holding member and the second motor, and a wafer inclining member for changing the tilt angle of the wafer with respect to the rotary drum by reciprocally rotating the supporting member on a first axis which is substantially parallel with the main surface of the wafer; and a moving member for bringing the wafer held on the supporting member into contact with or separating it from the tape wound around the rotary drum.
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申请公布号 |
US5928066(A) |
申请公布日期 |
1999.07.27 |
申请号 |
US19970993989 |
申请日期 |
1997.12.18 |
申请人 |
SHIN-ETSU HANDOTAI CO., LTD.;FUJIKOSHI MACHINERY |
发明人 |
HASEGAWA, FUMIHIKO;KURODA, YASUYOSHI;TSUCHIYA, TOSHIHIRO;ICHIKAWA, KOICHIRO;INADA, YASUO |
分类号 |
B24B9/06;B24D9/06;(IPC1-7):B24B5/00 |
主分类号 |
B24B9/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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