| 摘要 |
PROBLEM TO BE SOLVED: To achieve miniaturization, wt. reduction and cost reduction while suppressing heat generation by forming a rustproof coating film layer on the surface of a lead frame comprising hard copper and having a soldering part and exposing a lead to coat the lead frame with a super-engineering plastic resin. SOLUTION: A molded substrate is constituted of a plurality of soldering parts 1A to which electric parts are soldered, a lead frame 1 having a plurality of the leads 1B connected to an external circuit, the rustproof coating film layer formed on the surface of the lead frame 1, a plurality of the soldering parts 1A of the lead frame 1 and the molded resin body 2 covering the lead frame while exposing a plurality of the leads 1B. The molded resin body 2 is constituted of a superengineering plastic resin, for expample, a polyphenylene sulfide resin. The lead frame 1 is constituted of hard copper having predetermined conductivity capable of suppressing heat generation when a relatively large current is allowed to flow. |
