Thick film circuit having conductor composition with coated metallic particles

摘要

A thick-film conductor paste and thick-film conductors formed therefrom. The conductor paste is composed of metallic particles coated with a barrier layer that reduces leaching and solder diffusion into the conductor, thereby improving the reliability of the conductor-solder bond. The barrier layer may be continuous or discontinuous, and may be applied to some or all of the metallic particles of the conductor paste.