| 摘要 |
<p>A test probe interface unit for connecting a test device to a semiconductor device, the unit comprising a dielectric baseplate, probes arranged in the same pattern as contact pads of the IC, contacts connecting the probe unit to the test device and conductors providing electrical connection between the probe and the contacts, the probes being formed by surface displacement of the dielectric baseplate. The proposed invention provides high density of probes and simplifies the production process.</p> |
