| 摘要 |
PROBLEM TO BE SOLVED: To bond wires to adjacent electrodes arranged at a narrow pitch preventing a short circuit from occurring between the wires. SOLUTION: Electrodes 111, 112, 121, and 122 are arranged in zigzag so as to enable a large number of electrodes to be arranged in a narrow space. The outer electrode 111 of a first semiconductor device 110 is connected to the outer electrode 121 of a second semiconductor device 120 with an outer gold wire 131, and the inner electrode 112 of the first semiconductor device 110 is connected to the inner electrode 122 of the second semiconductor device 120 with an inner gold wire 132. A recrystallized part 132a of the inner gold wire 132 is set longer than a recrystallized part 131a of the outer gold wire 131, and the loop of the inner gold wire 132 is set higher than that of the outer gold wire 131. |
