| 摘要 |
PROBLEM TO BE SOLVED: To prevent the separation of a molding part from an external connecting terminal substrate and the disconnection of a wire etc., by providing the molding part obtained by covering the electrical connection part of each terminal and an IC chip provided on the external connecting terminal substrate with a molding resin in the whole area of the rear surface side of the external connecting terminal substrate. SOLUTION: At an IC module, each terminal and an IC chip 5 provided on an external connecting terminal substrate 8 of the IC module are electrically connected. The IC chip 5 and its connection part are covered with a molding resin such as an insulator like a BT resin, an epoxy resin or the like. At nearly the whole area of the rear surface side of the substrate 8, the flange part of the substrate 8 except a module part formed in a projecting shape by molding the chip 5 is shielded by the molding resin facing obliquely downward from the both edge parts of the substrate 8 to form the molding part 4 which is made in the shape of an inverse trapezoid and whose the bottom part is partially made flat. |
