| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring body which is arranged in a semiconductor device and a high frequency circuit provided with high noise resistance with respect to high frequency signals and a high-speed operation function. SOLUTION: This semiconductor device is provided with an insulation supporting base body, having with an opening 206 smaller than a semiconductor chip 100 and the wiring body 200A composed of wirings for signals, for a power source and for grounding or the like formed by printing on the first surface and second surface of the insulation supporting base body. The wiring body 200A is loaded on the semiconductor chip, bonding pads on the semiconductor chip 100 and the inner pad parts of the respective wirings for the signals, for the power source and for grounding of the wiring body 200A are connected by a first metallic thin wire 401 and the outer pad parts of the respective wirings and leads 301-303 inside a lead frame 300A are connected. A wiring pattern is finely and variously formed and an impedance matching function is provided as well. |
