发明名称 DEVICE AND METHOD OF LASER BEAM MACHINING
摘要 <p>PROBLEM TO BE SOLVED: To provide a laser beam machining device and its method that bring high yield and that realize high quality drilling. SOLUTION: This invention relates to a laser beam machining device and a method applicable to such device which is provided with a reflected light detector 12, a semiconductor device for detecting the intensity of light emitted by a laser generator 1 and reflected by a workpiece 7, with a control means 15 and the like for controlling the laser generator 1 based on a comparison between the intensity of the reflected light detected by the detector 12 and a prescribed reference value, and with a correcting means for correcting such intensity of the reflected light in accordance with the temperature change of the semiconductor device.</p>
申请公布号 JPH11192570(A) 申请公布日期 1999.07.21
申请号 JP19970338397 申请日期 1997.12.09
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KATO MAKOTO;KINOSHITA HISASHI;ISAJI KAZUHIDE
分类号 B23K26/00;B23K26/38;H05K3/00;(IPC1-7):B23K26/00 主分类号 B23K26/00
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