发明名称 |
DEVICE AND METHOD OF LASER BEAM MACHINING |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a laser beam machining device and its method that bring high yield and that realize high quality drilling. SOLUTION: This invention relates to a laser beam machining device and a method applicable to such device which is provided with a reflected light detector 12, a semiconductor device for detecting the intensity of light emitted by a laser generator 1 and reflected by a workpiece 7, with a control means 15 and the like for controlling the laser generator 1 based on a comparison between the intensity of the reflected light detected by the detector 12 and a prescribed reference value, and with a correcting means for correcting such intensity of the reflected light in accordance with the temperature change of the semiconductor device.</p> |
申请公布号 |
JPH11192570(A) |
申请公布日期 |
1999.07.21 |
申请号 |
JP19970338397 |
申请日期 |
1997.12.09 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
KATO MAKOTO;KINOSHITA HISASHI;ISAJI KAZUHIDE |
分类号 |
B23K26/00;B23K26/38;H05K3/00;(IPC1-7):B23K26/00 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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