| 摘要 |
PROBLEM TO BE SOLVED: To provide a molding device which is capable of preventing an IC package from increasing in manufacturing cost, releasing an IC package from a molding die and injection pins while protecting a semiconductor chip against fracture or cracking, and restraining a modification cost. SOLUTION: A first ejection pin 19a is formed longer than a second ejection pin 19b. Second springs 25, a second ejection pin return plates 23, a flange 21b of second ejection pint 19b, second ejection pin pressing plates 27, first springs 31, a first ejection pin return plate 29, flanges 21a of first ejection pins 19a, and a first ejection pressing plate 33 are arranged in this order from a recess 15 provided in a lower molding die 13. The total sum of spring forces of the second springs 25 is smaller than the total sum of spring forces of the first springs 31. |
