| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic multilayered substrate, which can form minute diameter and minute pitch and can form a via highly accurately in high efficiency. SOLUTION: In a ceramic multilayered substrate 10, insulating layers 1 provided at the inner layers and insulating layer 2, which are provided at the uppermost layer and the lowermost layer and constituted by forming a via and wirings at a photosensitive ceramic green sheet and burning. At inner electrode 20 is electrically connected to wiring patterns 11 at the upper surface or the back surface of the ceramic multilayered substrate 10 by the vias 30 and 40. By forming a hole in the photosensitive green sheet using photolithography technology and processing, the via having minute diameter and minute pitch can be formed highly accurately in high efficiency. Furthermore, since the simultaneous forming of the via holes can be performed by the photolithography technology, the formation of the via holes can be performed efficiently, change of design of the via can be performed only by the change of the photomask, and the manufacturing man-hours can be decreased. |
