发明名称 INSULATING SURFACE-TREATED METAL GRAIN
摘要 PROBLEM TO BE SOLVED: To obtain a grain suitable to form a conductor pattern for a ceramic green sheet by coating the surface of the metal grain with a thermoplastic insulating material to insulate it and making the average grain diameter within a specified range. SOLUTION: The average grain diameter of metal is 2-20μm, preferably 3-10μm. The content of a thermoplastic insulating material occupied in the grain is <=20 wt.% and the resistance value of the grain is preferably >=10<12>Ω.cm and copper, tungsten, nickel or silver is appropriate as the metal grain. A monomer is polymerized directly on the surface of the metal grain to preferably form a coating film consisting of the thermoplastic insulating material on the surface of the metal grain and a PE resin film is desirably formed by using a gaseous monomer. The grain diameter of a carrier in a two-components development method with which a developer is made by mixing it with the carrier is preferably 40-120μm and the content of the metal grain in the developer is 2-20 wt.%, preferably 3-10 wt.%. This grain is appropriately used as a toner in the developer of electrophotography.
申请公布号 JPH11193402(A) 申请公布日期 1999.07.21
申请号 JP19970367566 申请日期 1997.12.28
申请人 KYOCERA CORP 发明人 KOUDAKA HISASHI;KAMIYAMA YUJI;ISHII MASAKI;OZAWA YOSHIO
分类号 B22F1/02;H05K3/12;(IPC1-7):B22F1/02 主分类号 B22F1/02
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