发明名称 |
Method of forming embedded copper interconnections and embedded copper interconnection structure |
摘要 |
The embedded interconnections (15) of copper in an insulating layer (10) over a substrate, have protective silver films (17). The embedded interconnections are covered by another insulating layer. Independent claims are also included for the following: (1) multilayer embedded copper interconnection structure; and (2) method of forming embedded interconnections of copper. |
申请公布号 |
EP0903781(A3) |
申请公布日期 |
1999.07.21 |
申请号 |
EP19980117790 |
申请日期 |
1998.09.18 |
申请人 |
EBARA CORPORATION |
发明人 |
OGURE, NAOAKI;INOUE, HIROAKI |
分类号 |
H01L23/52;H01L21/288;H01L21/3205;H01L21/768;H01L23/532 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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