| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board without deformations such as warp or the like even in a bonding shelf part, in when one for which ceramic for forming the bonding shelf part is thin among the wiring boards of a ceramic laminated structure is manufactured which is provided with the bonding shelf part on the inner peripheral edge of a through-hole vertically passed through. SOLUTION: A non-calcined wiring board 1 formed by laminating plural green sheets 1a and 1b is mounted so as to be abutted against a flat base surface 51 in a calculation furnace, while the back surface 3 is faced downwards. At the time of calcination, not only is a weight 21 mounted on the upper surface of the green sheet 1a of a top layer, but also the weight 11 is mounted on the upper surface of the green sheet 1b for forming a bonding shelf part 5 as well, and calcination is performed while both upper surfaces to the side of the base surface 51 are pressed. |
