发明名称 PHOTOELECTRIC ELEMENT AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To manufacture an optical component for surface mounting technology having a slight structural profile at a significantly low cost by, forming electrode terminals of a structured thin coating part which is deposited on the outer surface of a socket member. SOLUTION: After a socket member 4 is manufactured along with electrode terminals 2, 3, a semiconductor chip 1 is bonded and a terminal wire 11 is brought into contact connection therewith before a lens 12 is fixed. It can be effected, using an appropriately structure cast plate. The cast plate forms a lens body 12 oriented towards a chip supporter band. Individual shapes are filled with epoxy resin, for example, and a chip supporter substrate is centered to the cast plate. Subsequently, the chip body provided with the lens 12 is separated into individual members through dicing process along with an array. Finally, individualized components are inspected and packaged through automation.
申请公布号 JPH11195794(A) 申请公布日期 1999.07.21
申请号 JP19980302606 申请日期 1998.10.23
申请人 SIEMENS AG 发明人 BRUNNER HERBERT;HURT HANS
分类号 H01L31/02;H01L31/0203;H01L31/024;H01L33/48;H01L33/64 主分类号 H01L31/02
代理机构 代理人
主权项
地址