发明名称 HEAT-TREATING DEVICE AND METHOD
摘要 <p>PROBLEM TO BE SOLVED: To satisfactorily reduce the temperature distribution generated on a heated material during a lamp heating time. SOLUTION: A plurality of spherical lamps 1 are oppositely arranged to a sheetlike wafer 2 so as to heat a wafer 2 by sectioning the spherical lamps 2 in almost concentric plural control zones for controlling the plural spherical lamps 1 per control zone. At this time, the spherical lamps 1 on the outer peripheral side than the wafer 2 are arranged so as to have the part wherein the arrangement density in the circumferential direction is thinner than positioned on the inner peripheral side thereby enabling the power consumption in the outer peripheral spherical lamps 1 to be cut down. Furthermore, the uneven temperature distribution in the cirumfetential direction can be suppressed by providing the parts with lower arrangement density in point symmetry centered around a specified position. As a result, the power consumption in the spherical lamps can be cut down while minimizing the effect on the wafer 2.</p>
申请公布号 JPH11195614(A) 申请公布日期 1999.07.21
申请号 JP19980293991 申请日期 1998.10.15
申请人 NIPPON SOKEN INC 发明人 KIMURA MINORU;ITO MASAATSU;TAKEDA SHIGERU;HIROSE SHOJI
分类号 H05B3/10;F21S8/04;H01J5/50;H01K7/00;H01L21/20;H01L21/26;(IPC1-7):H01L21/26 主分类号 H05B3/10
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