| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide high reliability and to save space as well. SOLUTION: A semiconductor chip 12 is fixed on a substrate, and the electrode terminal of the semiconductor chip 12 is connected to an electrode terminal base 14 formed on the substrate. To the electrode terminal base 14, at least a junction end part 16-1 is connected by the ultrasonic wave junction of a plate-like external electrode terminal 16. The semiconductor chip 12 fixed on the substrate, the electrode terminal base 14 and the external electrode terminal 16 are housed inside a resin case, so as to expose the other end of the external electrode terminal 16.</p> |
