发明名称 SCALABLE WIDE ARRAY INK JET PRINTING HEAD AND ITS PRODUCTION
摘要 PROBLEM TO BE SOLVED: To provide a scalable wide array printing head. SOLUTION: A scalable wide array printing head 12 is formed by mounting a large number of thermal ink jet printing heads 18 on a support substrate 20. The printing head 12 is mounted on one surface of the support 20 and the opposite surface 72 of the support 20 is loaded with logical ICs 29 and drive ICs 30. Mutual connection 90 is formed through the support substrate and the printing head 12 is electrically connected to the logical ICs and the drive ICs. The support substrate 20 is formed from silicon and etched in order to demarcate ink supply slots 42. The mounting processing of solder bumps 78 is used in order to mount the printing head 12 on the support substrate 20. This processing is operated so as to align the printing heads 18 and solder form a fluid boundary around each of the ink slots 32 of the printing head 12.
申请公布号 JPH11192705(A) 申请公布日期 1999.07.21
申请号 JP19980300514 申请日期 1998.10.22
申请人 HEWLETT PACKARD CO <HP> 发明人 BEERLING TIMOTHY E;WEBER TIMOTHY L;BOYD MELISSA D
分类号 B41J2/05;B41J2/14;B41J2/155;B41J2/16;(IPC1-7):B41J2/05 主分类号 B41J2/05
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