发明名称 |
A method for examining bonded-metal by ultrasonic examination |
摘要 |
<p>A method for examining bonded-metal by ultrasonic examination, the method comprises a step of measuring an attenuation amount of an ultrasonic wave, the ultrasonic wave being generated by a sending probe and received by a receiving probe through a bonding interface, the sending probe and the receiving probe being disposed on the bonded-metal with putting the bonding interface therebetween, the bonded-metal being bonded under unknown condition and a step of examining a bonding property of the bonded-metal based on the attenuation amount, with utilizing a relationship between a bonding property and an attenuation amount for standard metal bonded under known condition measured preliminary.</p> |
申请公布号 |
EP0930502(A2) |
申请公布日期 |
1999.07.21 |
申请号 |
EP19980124887 |
申请日期 |
1998.12.30 |
申请人 |
DAIDO TOKUSHUKO KABUSHIKI KAISHA |
发明人 |
HIROTSUGU, HORIO;HISAO, NAKASE |
分类号 |
G01N29/11;G01N29/44;(IPC1-7):G01N29/10;G01N29/20 |
主分类号 |
G01N29/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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