| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a low-cost, multiple chip type semiconductor IC that has a protective element or circuit for preventing electrostatic breakdowns. SOLUTION: A semiconductor IC comprises a first semiconductor circuit chip that has a protective element or correct for preventing electrostatic breakdown on at least one of I/O terminals 6 and 6', and a second semiconductor circuit chip that does not have a protective element or circuit on an I/O terminal 9, or has a protective element or circuit with an electrostatic breakdown threshold which is lower than that of the first semiconductor circuit chip. Here, an external connecting terminal 1 of a semiconductor IC 11 device from the semiconductor package and the output terminal 6 of a first semiconductor circuit chip 3 are connected electrically via a connecting member 2. The input terminal 6' of the first semiconductor circuit chip 3 connected to a protective element 4 for preventing electrical breakdowns, and the output terminal 9 of the second semiconductor circuit chip 8 are connected electrically via a connection member 7.</p> |
