| 摘要 |
PROBLEM TO BE SOLVED: To realize high reliability by preventing wire breakdown of a VIA with regard to a multilayered thin-film wiring substrate having the VIA, which performs interlayer junction. SOLUTION: In a multilayered thin-film wiring substrate, which has the structure wherein a plurality of wiring layers 36-46 and an interlayer insulating film 48 are laminated on a ceramic base material 34, and has an interlayer connecting VIA 50 having the structure, wherein the wiring layers 36-46 are laminated so as to penetrate the above described interlayer insulating film 48, the second wiring layer 38 among a plurality of the wiring layers 36-46 constituting the interlayer insulating VIA is branched so as to extend in the extending direction of the ceramic base material 34, and a branched VIA 54 is formed. Furthermore, this branched VIA 54 is bonded to the first wiring layer 36, which is located closest the ceramic base material 34. |
