发明名称 |
Lead-on-chip type semicoductor device having thin plate and method for manufacturing the same |
摘要 |
In a semiconductor device having a lead-on-chip structure, a thin plate (9) is arranged in an outer peripheral area of a semiconductor element (1B) and has a thickness substantially the same as that of the semiconductor element. <IMAGE> |
申请公布号 |
EP0930646(A2) |
申请公布日期 |
1999.07.21 |
申请号 |
EP19990100733 |
申请日期 |
1999.01.15 |
申请人 |
NEC CORPORATION |
发明人 |
INABA, TAKEHITO |
分类号 |
H01L23/28;H01L21/52;H01L21/56;H01L21/60;H01L23/495 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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