发明名称 SEMICONDUCTOR MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide the number of connecting plugs which of which is two times without changing a pitch by forming connecting plug terminals provided at a front and a back surfaces of an insulating substrate, so that the terminal becomes the individual connecting plug terminal, which is electrically insulated to each other. SOLUTION: Eight memories IC 30 are mounted on front and back surfaces of an insulating substrate 10, respectively. Connecting plug terminals 11a, 11b, 11c..., having the same shape are formed at the equal pitch along one side of the substrate. The connecting plug terminals 11a, 11b, 11c... on the front side and the connecting plug terminals 11a', 11b', 11c'... on the back side are insulated electrically so that the positions are deviated by a half pitch, respectively. When the number of the connecting plug terminals are equal, the size of the insulating substrate can be made approximately half. Since the highly softening temperature glass having the thermal expansion coefficient of about 100 ppm is used as the material to the substrate 10, a memory IC 20 having a thin-type small outline package structure, having thermal expansion coefficient of about 5 ppm, wherein a lead terminal is bent so as to expand outwards, can be used.
申请公布号 JPH11195749(A) 申请公布日期 1999.07.21
申请号 JP19980293237 申请日期 1998.10.15
申请人 HITACHI LTD;HITACHI TOBU SEMICONDUCTOR LTD 发明人 KANNO TOSHIO;TSUKUI SEIICHIRO
分类号 G11C5/00;H01L25/10;H01L25/11;H01L25/18;H05K1/02;H05K1/11;H05K1/14;H05K13/04;(IPC1-7):H01L25/10 主分类号 G11C5/00
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